PCB Assembly - Hanarey 瀚纳瑞

Light-Curable Materials for Print Circuit Board Assembly

Hanarey offers a broad range of light-curable materials for use in circuit protection and electronic assembly applications. These materials cure in seconds for faster processing and higher throughput and are available with many innovative and patented technologies that turn problems like shadow areas, cure confirmation, and difficult inspection into non-issues.

The materials are electrically insulating, making them a perfect fit for conformal coating, encapsulation, bonding, thermal management, masking, and many other electronic assembly processes. Hanarey light-curable materials are one-part materials, no mixing or preparation is required before application.

all icons-16 — Excellent adhesion to a variety of substrates

Cure with LED, UV, or visible lights in seconds

all icons-14 — One component, no mixing required

Product Number	Features/Applications	Nominal Viscosity, cP	Durometer Hardness	Tensile at Break, psi	Elongation at Break, %
CSE4340	Encapsulation Excellent adhesion to a wide variety of substrates including glass, many plastics and most metals Good flexibility with enhanced the load bearing and shock absorbing characteristics of the bond area Fast curing	40,000~70,000	D45~D70	2,370	157
CSE4525-R	Encapsulation Bright red appearance for easy visual inspection Excellent adhesion to a wide variety of substrates including PCB, most plastics and metals Cure at a rapid speed with exposure to UV	16,000~26,000	D60~D80	4,163	163
CSE4539	Encapsulation UV and moisture cure Excellent moisture resistance and chemical resistance ability Cure at a rapid speed	15,000~28,000	D61	2,756	7.88
CSE4552-G	Medium viscosity Designed for a variety of coating applications with strict requirements for moisture resistance, such as ITO/COG protective coating for display module assembly Fast cure with exposure to mercury lamp or 365nm LED lamp	756	D66	1,172	186
CSE4558	Designed for protection of COF (Chip-on-Film) in LCD modulesy Cure at a rapid speed with exposure to 365nm LED lighty Flexibility to enable stress absorption and provide extra protection from cracking in functional testing	756	D40	1,379	58.1
CSE6508	Thermosetting epoxy, low-temperature heat cure Excellent adhesion to various substrated such as opaque glass, plastic, and metal	83,000	D87	4,931	3.7
CSE6587	Thermosetting epoxy High glass transition temperature (Tg) Low thermal expansion coefficient Good temperature resistance and impact resistance	35,000	D90	8,557	1.7
CSE9568	UV and moisture cured conformal coating Excellent properties of moisture resistance and chemical resistance	60~200	D50~D75	2,364	2.0
CSE9715-C	UV and moisture curable conformal coatingy Suitable for all kinds of spraying processy Superior resistance to moisture and chemical	80~120	A60~A75	636	63.3
CSE9716-C	UV and moisture curable conformal coating Suitable for all kinds of spraying process Superior resistance to moisture and chemical	800	A65~A90	2,181	10.15
CSE9718-C	UV and moisture curable conformal coating Suitable for all kinds of spraying process Superior resistance to moisture and chemical	250~450	D40~D70	1,969	3.87
CSG4937	Encapsulation Transparent liquid, medium viscosity with thixotropic Excellent adhesion to a wide variety of substrates including glass, many plastics, and most metals High elongation with enhanced load bearing and shock absorbing characteristics of the bond area	4,400~7,400	D40~D70	1,265	186.33
Dymax Materials	Master distributor for Dymax PCB assembly materials

Product Number

Features/Applications

Nominal Viscosity, cP

Durometer Hardness

Tensile at Break, psi

Elongation at Break, %

CSE4340

Encapsulation
Excellent adhesion to a wide variety of substrates including glass, many plastics and most metals
Good flexibility with enhanced the load bearing and shock absorbing characteristics of the bond area
Fast curing

40,000~70,000

D45~D70

2,370

157

CSE4525-R

Encapsulation
Bright red appearance for easy visual inspection
Excellent adhesion to a wide variety of substrates including PCB, most plastics and metals
Cure at a rapid speed with exposure to UV

16,000~26,000

D60~D80

4,163

163

CSE4539

Encapsulation
UV and moisture cure
Excellent moisture resistance and chemical resistance ability
Cure at a rapid speed

15,000~28,000

D61

2,756

7.88

CSE4552-G

Medium viscosity
Designed for a variety of coating applications with strict requirements for moisture resistance, such as ITO/COG protective coating for display module assembly
Fast cure with exposure to mercury lamp or 365nm LED lamp

756

D66

1,172

186

CSE4558

Designed for protection of COF (Chip-on-Film) in LCD modulesy
Cure at a rapid speed with exposure to 365nm LED lighty
Flexibility to enable stress absorption and provide extra protection from cracking in functional testing

756

D40

1,379

58.1

CSE6508

Thermosetting epoxy, low-temperature heat cure
Excellent adhesion to various substrated such as opaque glass, plastic, and metal

83,000

D87

4,931

3.7

CSE6587

Thermosetting epoxy
High glass transition temperature (Tg)
Low thermal expansion coefficient
Good temperature resistance and impact resistance

35,000

D90

8,557

1.7

CSE9568

UV and moisture cured conformal coating
Excellent properties of moisture resistance and chemical resistance

60~200

D50~D75

2,364

2.0

CSE9715-C

UV and moisture curable conformal coatingy
Suitable for all kinds of spraying processy
Superior resistance to moisture and chemical

80~120

A60~A75

636

63.3

CSE9716-C

UV and moisture curable conformal coating
Suitable for all kinds of spraying process
Superior resistance to moisture and chemical

800

A65~A90

2,181

10.15

CSE9718-C

UV and moisture curable conformal coating
Suitable for all kinds of spraying process
Superior resistance to moisture and chemical

250~450

D40~D70

1,969

3.87

CSG4937

Encapsulation
Transparent liquid, medium viscosity with thixotropic
Excellent adhesion to a wide variety of substrates including glass, many plastics, and most metals
High elongation with enhanced load bearing and shock absorbing characteristics of the bond area

4,400~7,400

D40~D70

1,265

186.33

Dymax Materials

Master distributor for Dymax PCB assembly materials

Light-Curable Materials for Print Circuit Board Assembly

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