Light-Curable Materials for Print Circuit Board Assembly

Hanarey offers a broad range of light-curable materials for use in circuit protection and electronic assembly applications. These materials cure in seconds for faster processing and higher throughput and are available with many innovative and patented technologies that turn problems like shadow areas, cure confirmation, and difficult inspection into non-issues.

The materials are electrically insulating, making them a perfect fit for conformal coating, encapsulation, bonding, thermal management, masking, and many other electronic assembly processes. Hanarey light-curable materials are one-part materials, no mixing or preparation is required before application.

Features

Products

Product NumberFeatures/ApplicationsNominal Viscosity, cPDurometer HardnessTensile at Break, psiElongation at Break, %
CSE4340
  • Encapsulation
  • Excellent adhesion to a wide variety of substrates including glass, many plastics and most metals
  • Good flexibility with enhanced the load bearing and shock absorbing characteristics of the bond area
  • Fast curing
40,000~70,000D45~D702,370157
CSE9715-C
  • UV and moisture curable conformal coating
  • Suitable for all kinds of spraying process
  • Superior resistance to moisture and chemical
80~120A60~A7563663.3
CSE9716-C
  • UV and moisture curable conformal coating
  • Suitable for all kinds of spraying process
  • Superior resistance to moisture and chemical
800A65~A902,18110.15
CSE9718-C
  • UV and moisture curable conformal coating
  • Suitable for all kinds of spraying process
  • Superior resistance to moisture and chemical
250~450D40~D701,9693.87
CSE4552-G (testing)
  • Medium viscosity
  • Designed for a variety of coating applications with strict requirements for moisture resistance, such as ITO/COG protective coating for display module assembly
  • Fast cure with exposure to mercury lamp or 365nm LED lamp
756D661,172186
Dymax Materials     
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